As a leading ‘one-stop’ total Burn-In solutions provider to the semi-conductor industry, our principal business activities involve the provision of the following:

• Burn-In and Related Services

There are two business activities within this segment:
(a) Burn-In Service; and
(b) Tape and Reel Service

(a)Burn-In Service
We provide Static Burn-In, Dynamic Burn-In and TDBI for the semiconductor industry. Burn-In is a process in between the assembly and final test processes in the semiconductor manufacturing chain. It is a process whereby the individual semiconductor device is stressed at extreme temperatures with voltages and test signals applied to weed out infant mortality failures (that is, any defects caused during the design and assembly process) with the extreme temperature environment in the Burn-In chamber. Any semiconductor device that fails the Burn-In screening process will be rejected.

The Burn-In process duration is specified by the customers depending on the device types, the specific applications of the semiconductor device and the designed reliability. The Burn-In temperature is also specified by the customer and ranges anywhere from -40 degrees Celsius to +150 degrees Celsius.

Currently, we have over 120 Burn-In Systems in our in-house facilities supporting the Burn-In of different semiconductor device types ranging from microprocessors, memories, micro-controllers, automotive control circuits and custom made chips, small-outline IC package, plastic leaded chip carrier package, quad flat pack, no-leads package, thin shrink small-outline package to the latest pin grid array and ball grid array.

Many of the Burn-In Systems used in our business are designed and fabricated within our in-house facilities. We operate 24 hours daily seven days per week on four shifts. We also offer round the clock delivery and collection services to our customers.





(b)Tape and Reel Service
We provide Tape and Reel Service for customers who need their finished products to be delivered in a reel form.

We employ the use of machines that can perform this function efficiently and meeting the inspection criteria set by our customers on, for example, marking legibility, bent leads, orientation, scratches, package contamination and micro-cracks. The machines have sophisticated cameras installed to capture the package images and compare the images with the software defined tolerances to bin them for taping or rejection. Inputs can be either in a tray or tube form and output in the reel.

We provide a similar round the clock delivery and collection service for these customers as do our Burn-In service customers.


• Burn-In Boards and Boards Related Products

We are involved in the design, manufacture and assembly of Burn-In Boards for different types of Burn-In ranging from Static Burn-In, Dynamic Burn-In to TDBI and also for other different types of reliability tests, like High Operating Life Test (‘HTOL’) and Highly Accelerated Temperature/Humidity Stress Test ("HAST").


• Engineering Services and Equipment Distribution

Our engineering services are broadly categorised into two divisions:
(a) System Integration and Equipment Manufacturing
(b) Technical Services



(a) System Integration and Equipment Manufacturing
We carry out mainly system integration projects and equipment manufacturing services.

For system integration (built to design) projects, we perform full turnkey system integration services ranging from parts procurement, parts fabrication, system assembly to system verification based on drawings and specifications provided by our customers. We also recommend enhancements and improvement to our customers’ designs as a value-added service to them. One of our competitive strengths is the provision of system integration services for refrigeration based High Power Burn-In Systems. Since February 2006, we have significantly expanded our engineering services in this area of services to be provided to our customers.

For equipment manufacturing (design and build) services, we perform detailed reviews of our customer’s needs, requests and specifications on equipment requirements, in order to design and build the equipment. We are also involved in parts procurement, parts fabrication, equipment assembly and equipment verification. In addition to the engineering services provided as set out above, we are also commissioned by our customers to redesign their existing equipment. With our ability to integrate our expertise within our engineering department, we are able to deploy and perform appropriate value added engineering work that reduces production, manufacturing and/or testing costs for our customers. We achieve this by analysing our customer’s production, manufacturing or testing processes and equipment to determine if the operations can be simplified or made more reliable or efficient through re-engineering.

(b) Technical Services
We provide field service and application support to our customers for all equipment that we manufacture and distribute, in particular, we provide equipment installation services, training and after sales service. We also provide to our customers field service and application support for system integration projects undertaken by us. Working with our technology partners who are based overseas, we also perform first line repair services for their customers located in Singapore.

Equipment Distribution

We distribute equipment and related products used in the semiconductor industry. In particular, we distribute third party Burn-In and test equipment used in the semiconductor industry for the Burn-In, testing and packaging of semiconductor devices. Some of the key third party equipment and products we distribute include automated Test Handlers, Wafer Probers and Mixed Signal Testers. On a smaller scale, we also distribute third party test sockets and tester loadboards.