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Solution
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BURN-IN


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BURN-IN


BURN-IN SERVICES

WE ARE ONE OF THE MARKET LEADERS PROVIDING BURN-IN SERVICES INCLUDING STATIC BURN-IN, TEST DURING BURN-IN AND HIGH POWER BURN-IN. WE WORK WITH LEADING SEMICONDUCTOR MANUFACTURERS, SERVING THE SEGMENT OF THE INDUSTRY THAT REQUIRES FAIL-SAFE OR HIGH RELIABILITY SEMICONDUCTOR DEVICES. THESE INCLUDE MICROPROCESSORS AND MICROCONTROLLERS FOR AUTOMOTIVE, INCLUDING ELECTRIC VEHICLES, IoT AND NETWORKING PRODUCTS, AND MOBILE DEVICES. OUR PORTFOLIO OF CUSTOMERS SPANS ASIA, EUROPE AND THE UNITED STATES.  

Under this business segment, we also provide Tape and Reel Services which employ the use of machines that allow customers' finished products to be delivered in reel form. Currently, we have machines handling different packages from BGA, TSSOP, VQFN and DSO, with round-the-clock delivery and collection services for our customers.

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BURN-IN BOARDS MANUFACTURING AND PCBA SERVICES


BURN-IN BOARDS MANUFACTURING AND PCBA SERVICES


MANUFACTURING & PCBA SERVICES

WE ARE INVOLVED IN THE DESIGN, MANUFACTURE AND ASSEMBLY OF A WIDE RANGE OF BURN-IN BOARDS AND AUTOMATIC TEST EQUIPMENT/LOAD BOARDS. THESE INCLUDE BOARDS FOR OTHER TYPES OF RELIABILITY TESTS SUCH AS HIGH TEMPERATURE OPERATING LIFE TEST AND HIGHLY ACCELERATED STRESS TEST. WE ARE ALSO QUALIFIED TO BUILD BURN-IN BOARDS FOR HIGH POWER DEVICES.

In addition, we provide imaging (X-Ray) services and diagnostic solutions and niche PCBA Services for the medical, mobile communications, optics, aviation, avionics, networking, security, electronics, and other emerging industries. Under this segment, we also provide one-stop solutions for the design and manufacture of robotics hardware which complement navigation, fleet management and other robotics software for use in a wide range of applications.

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ENGINEERING


ENGINEERING


ENGINEERING SERVICES

OUR ENGINEERING SERVICES RANGE FROM DESIGN AND DEVELOPMENT, FULL TURNKEY OUTSOURCED MANUFACTURING, AND SYSTEM INTEGRATION OF SEMICONDUCTOR EQUIPMENT AND LAB-AUTOMATION SYSTEMS FOR THE LIFE SCIENCES AND BIOTECH INDUSTRIES. WE ALSO RECOMMEND ENHANCEMENTS AND IMPROVEMENTS TO OUR CUSTOMERS’ DESIGNS AS A VALUE-ADDED SERVICE TO THEM.

One of our competitive strengths is the provision of system integration services for refrigeration-based High Power Burn-In Systems and Lithography Tool for semiconductor front-end applications. We have significantly expanded our engineering services in this area of specialisation since 2006. Our projects also include Charged Coupled Device (“CCD”) cameras for astronomy and life sciences applications, digital imagers as well as customised LED drivers and products for various applications. In addition, we distribute and service third-party Mixed Signal Testers for the semiconductor industry.